ONTOS CLEAN

ONTOS CLEAN is a semiautomated system for Surface Preparation using a patented Atmospheric Plasma with a unique design enabling, without any modification, oxidizing or reducing chemistry.

Ontos performs Cleaning, Eliminates the Organic Contamination, Activates Surfaces and Removes Oxidation.

An Innovative Process applies a gaseous passivation that delays the re-oxidation of the metallic surfaces


ONTOS Clean

Introducing
ONTOS Clean
ONTOS Clean
ONTOS Clean

ONTOS Clean

The next generation in surface preparation

SYSTEM DESCRIPTION/SPECIFICATIONS:

  • Uniquely-designed atmospheric plasma system with 25mm, 40mm or 105mm-wide standard process zone. The glow discharge type plasma is entirely contained inside the source.
  • Computer-controlled X-Y-Z stage. Standard vacuum chuck accommodates die or wafer from 2 to 300mm. Substrate thicknesses up to 20 mm (30mm without lift pins).
  • The 13.56 MHz RF generator has a wide-range auto-tune matching network, system safety monitoring and computer control of forward and reflected power.
  • Digital Mass Flow controllers provide precise digital control of gas flow to the plasma source.
  • ESD-safe, interlocked enclosure; Exhaust for process gases (no scrubber required).
  • Semi-automatic system controlled by Touchscreen Computer.
  • Menu-driven interface with user-configurable recipe libraries.
  • Lift-Pins enable eventual pass-through for automated handling.

Facilities required:

  • Power: Single Phase, 110/240 VAC, 8/4A, 50/60Hz.
  • Gases: 6 channels of gas supply by 1/4” Teflon tubing; Swagelok compression fittings. (All gases are non-toxic, non-flammable.)
  • Optional Oxygen plasma configuration available upon request
  • Exhaust: 15~20 cfm (424~566 l/min), 3” connection.
  • Lab vacuum: 0.85 ~ 0.95 bars (2 ~10 SLPM).

Technical Drawing

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ONTOS CLEAN
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