Because all of the high-energy charged plasma particles have recombined by the time the gas stream exits the aperture, the reactions on the surface are accomplished without any bombardment. This means that your substrate will NOT be subjected to sputtering damage or electric field discharge – this is very important for sensitive surfaces!
ONTOS Atmospheric Plasma does not require a process chamber or controlled ambient. Typically, the gas aperture is spaced only a millimeter or two above your substrate. The gas flow exiting the aperture displaces the atmosphere in the space between the plasma head and the substrate. This creates an exclusion zone filled only with the downstream gas, and allows the chemical surface reactions to proceed without interference from room air.